MIL-HDBK-5J

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MIL-HDBK-5J, DOD HANDBOOK METALLIC MATERIALS AND ELEMENTS FOR AEROSPACE VEHICLE STRUCTURES (31 JAN 2003) [S/S BY MMPDS-01] (70 MB DOWNLOAD)., This handbook is approved for use by all Departments and Agencies of the Department of Defense and the Federal Aviation Administration. This is the last planned edition of MIL-HDBK-5. MIL-HDBK- 5J is equivalent to MMPDS-01, the first edition of the Metallic Material Properties Development and Standardization Handbook, which is maintained by the Federal Aviation Administration. The FAA plans to publish annual updates and revisions to the MMPDS. As a result, MIL-HDBK-5J is scheduled to be reclassifed as noncurrent in the Spring of 2004. It will be superseded at that time by the MMPDS Handbook. This handbook is for guidance only. This handbook cannot be cited as a requirement. If it is, the contractor does not have to comply. 3. This document contains design information on the strength properties of metallic materials and elements for aerospace vehicle structures. All information and data contained in this handbook have been coordinated with the Air Force, Army, Navy, Federal Aviation Administration, and industry prior to publication, and are being maintained as a joint effort of the Federal Aviation Administration and the Department of Defense.

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【英文标准名称】:Informationtechnology.Telecommunicationsandinformationexchangebetweensystems.IntermediatesystemtoIntermediatesystemintra-domainrouteinginformationexchangeprotocolforuseinconjunctionwiththeprotocolforprovidingtheconnectionless-m
【原文标准名称】:信息技术.电信和系统间的信息交换.供非连接方式网络服务协议连接用中间系统与中间系统域内通信信息交换协议
【标准号】:BSISO/IEC10589-1992
【标准状态】:作废
【国别】:英国
【发布日期】:1992-10-15
【实施或试行日期】:
【发布单位】:英国标准学会(BSI)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:网络层;数据传输控制规程;通信规程;算法;数据传送;合格;中间的;编码(数据转换);计算机网络;数据处理;开放系统互连;信息交流;数据传输
【英文主题词】:
【摘要】:
【中国标准分类号】:L79
【国际标准分类号】:33_040_40;35_100_30
【页数】:
【正文语种】:英语


基本信息
标准名称:电荷耦合成像组件通用规范
英文名称:General specification for imaging charge coupled assemblies
中标分类: 电子元器件与信息技术 >> 光电子器件 >> 半导体光敏器件
ICS分类: 电子学 >> 半导体器件
发布日期:2007-07-14
实施日期:2007-12-01
首发日期:
作废日期:
出版日期:
页数:11
适用范围

本规范规定了电荷耦合成像组件生产和交付使用的通用要求、质量保证规定、试验和检验方法等。

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所属分类: 电子元器件与信息技术 光电子器件 半导体光敏器件 电子学 半导体器件